<azonenberg>
So i'm now pretty convinced that homebrewing a sputtering apparatus is possible
<Helldesk>
do you use any gas in the chambe?
<Helldesk>
chamber, that is
<azonenberg>
Helldesk: For evaporation? no
<azonenberg>
for sputtering, either argon (for normal DC sputtering)
<azonenberg>
or argon plus oxygen/nitrogen to reactive sputter oxides and nitrides respectively
<azonenberg>
Evaporation is done in the 1E-6 torr range and sputtering at 1E-2 ish
<Helldesk>
is that still in the ballistic range or do the sputtered ions do a random walk?
<Helldesk>
after they shoot off the target
<azonenberg>
Helldesk: Sputtered are random
<azonenberg>
And thus the coating is conformal
<azonenberg>
Evaporation is ballistic so you can cast shadows etc
<azonenberg>
I'm working this weekend but hoping to do Ni + Cr (Ni hardmask over Cr adhesion layer) evap over my latest wafer some time early next week
<azonenberg>
then try my second serious attempt at a full through wafer etch
<azonenberg>
and hopefully my first successful one :p
<Helldesk>
ah, I see
<Helldesk>
for Ni, argon seems to be just as good as krypton, and when you're doing Cr too it's the best choice
<azonenberg>
Yeah, argon is the de facto standard
<azonenberg>
neon and krypton are used occasionally
<azonenberg>
but argon is right in the middle mass wise
<azonenberg>
cheap
<azonenberg>
"good enough" for most purposes
<Helldesk>
closest atomic weight to most of the metals needed, right?