21:39 <houkime> FINALLY!. Looks like I have finally found a plausible solution!

21:40 <houkime> Or at least a trace to it. this is awesome

21:45 <houkime> we might need to add some esds though because thay can't be utilized 100% efficiently

22:18 <knttl> houkime: random 'thank you' for helping out the project :)

23:05 <houkime> although the problem with usb charger itself still remains. The thing is you can't just go over it like joerg says. It has a exp plate which blocks "go through". Interestingly enough other GTA04 variants solve this problem somehow but I can't find layout files.

23:05 <Joerg-Neo900> short stubs don't matter

23:06 <Joerg-Neo900> you don't need to "run the trace through the pin"

23:06 <Joerg-Neo900> plus we got at very least 4 layers

23:07 <houkime> It will need to be 2 short stubs with vias then/

23:07 <Joerg-Neo900> so you actually can run the traces thoriugh the via in pad

23:08 <Joerg-Neo900> though stubs are fine when they are not too long - maybe < 5mm

23:09 <houkime> No, there won't be a real via in a pad. no need. I can make just a kittle bit thicker annual ring then. No solder needed here

23:10 <Joerg-Neo900> :-)

23:11 <Joerg-Neo900> i'd like to avoid in-pad vias on LOWER, I huess we can get away without them, they are expensive

23:12 <Joerg-Neo900> we'll need them for OMAP though

23:12 <Joerg-Neo900> and maybe actually need them for modem module LGA

23:12 <Joerg-Neo900> on lower

23:13 <houkime> Metacollin used many thermal vias in a pad.

23:13 <Joerg-Neo900> then LGA are such miinster sized pads, a in-pad via wouldn't need to be plated, just capped or plugged

23:13 <Joerg-Neo900> monster*

23:14 <Joerg-Neo900> ooh, yeah. thermal vias. makes sense, those are plenty so we might actually need plated vias

23:15 <houkime> they need to be plated. At least some of them. Otherwise they won't connect to the groundplane

23:18 <Joerg-Neo900> hm? never heard that

23:18 <Joerg-Neo900> I mean copper cap so you don't see the via anymore

23:19 <Joerg-Neo900> not the via tube plating to make it conduct

23:19 <Joerg-Neo900> a via without that is a drill

23:19 <Joerg-Neo900> ;-)

23:20 <houkime> oh... Yep, my bad.

23:22 <Joerg-Neo900> np, possibly my nomenclature is not in line with common usage

23:22 <Joerg-Neo900> seems often they are called tented vias

23:23 <houkime> nononono tented vias are separate

23:23 <Joerg-Neo900> though in other docs "tented" means "covered by solder stop"

23:23 <houkime> tented are about soldermask and conformal coating

23:24 <Joerg-Neo900> https://www.pcbuniverse.com/pcbu-tech-tips.php?a=5 whatever

23:25 <Joerg-Neo900> "Vias Plated Shut with Copper"

23:26 <Joerg-Neo900> "Via In Pad (Active Pad)"

23:27 <Joerg-Neo900> seems there's a bazillion names for it

23:30 <Joerg-Neo900> let's agree on open vias in pads are a poor idea that gives headache during assembly

23:31 <Joerg-Neo900> so in-pad vias shall always be filled/plugged and covered by copper plating

23:33 <Joerg-Neo900> aiui you however need to think about which types of blind vias you want to mix on same board, PCB houses can't make arbitrary mixes

23:34 <houkime> ok.

23:34 <Joerg-Neo900> thanks to the fact that a multilayer PCB is just multiple 2layer laminated together by prepreg to form a stack, and blind vias are just "full" vias on a partial stack

23:35 <Joerg-Neo900> so the sequence of stacking determines which blind vias can be done

23:35 <Joerg-Neo900> *AIUI*

23:35 <Joerg-Neo900> !!!

23:38 <Joerg-Neo900> there of course are also stacked vias, though the jury seems to be still out on those

23:38 <Joerg-Neo900> seems they have reliability issues

23:40 <jake42> houkime: I believe GTA04 layout is here http://download.goldelico.com/gta04-hardware/CAD/GTA04A5/ (though no software to check here)

23:42 <Joerg-Neo900> http://www.saturnflex.com/hdi_pcb/index.php http://www.mst.com/dyconex/technology/enabling_technologies/stacked_vias/

23:44 <Joerg-Neo900> >>Furthermore, filled vias give designers exacting control of how operating heat is routed to the PCB's surface for its efficient dissipation<<

23:46 <Joerg-Neo900> https://www.7pcb.com/blog/splitting-interconnect-blind-vias-into-stack-up-vias.php

23:58 <houkime> Checked out GTA04 usb interface layout. Epic. They for sure didn't bother with the scew

23:59 <houkime> does not look like they had much choice though