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<Sync_>
win. the wafer roboter stopped shooting wafers into the walls of the chamber
<azonenberg>
Sync_: that sounds like a good thing
* soul-d
imagining some one modified a clay pigeon shooting device for wafers
<azonenberg>
Lol
<azonenberg>
And you shoot them with a FIB? :p
<azonenberg>
PULL! *blow away some PIC12F683s with overetched M3*
<azonenberg>
PULL! *process characterization wafer is blown to smithereens*
<soul-d>
whats a fib ? fast inair beam
<azonenberg>
focused ion beam
<azonenberg>
which wont work outside a vacuum and is thus highly impractical for skeet shooting
<soul-d>
you probably also would like to get rid of gravity if you want to have an effect on it i guess
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<Sync_>
it is azonenberg
<Sync_>
the most annoying thing was after you waited 2 weeks for the system to pump down the first waver does not go into the process chamber but BAM right into the wall
<azonenberg>
two weeks? What is this
<azonenberg>
the longest pump-down delay i've seen was ~2 hrs on a sputtering system
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<Sync_>
azonenberg: well, it is an experimental production solution
<azonenberg>
oh, i see
<Sync_>
and we need to get around 10^-9 to 10^-10mbar in there
<Sync_>
we have a xrf and such in there, this is why we have the waver handler
<Sync_>
I also do waver calibration, which is insanely boring
<azonenberg>
lol
<Sync_>
well, you sit infront of the xray and write down the orientation
<azonenberg>
when you say calibration
<azonenberg>
do you mean finding the exact angle of the crystal structure to the flat?
<azonenberg>
Since i know flats are normally only within a degree or so
<Sync_>
yes
<Sync_>
I determine them to about .05°
<azonenberg>
And what are they used for after that?
<azonenberg>
KOH and related etches are the only situations i know of that you need orientation that precisely
<Sync_>
mostly experiments with epitactic surface coating