20:31 <whitequark> test

20:32 <whitequark> there's something really FUBAR with IPv6 at this host and my logger bot :/

20:59 <DocScrutinizer> whitequark: when doing a PCB teardown to RE the circuit, you may want to take ULTRA-highres scans of each layer, and maybe even manually mark all vias you can find, on each layer

21:00 <DocScrutinizer> vias are most important key part for RE, and most PITA to detect and find on scans/photos

21:01 <DocScrutinizer> I prefer the idea of doing an electrical RE. Apply voltage to one pad, see which other pads also have voltage. I got quite a bunch of weird ideas how to simplify resp automatise that

21:02 <DocScrutinizer> e.g you could do all that under water, use DC, and see where gas bubbles from electrolysis appear on the connected pads

21:02 <DocScrutinizer> on good macro photos you probably can see the bubbles quite easily

21:03 <DocScrutinizer> another possibility: use phenolphtalein or another idicator and see where pH-level of water changes due to electrolysis

21:03 <DocScrutinizer> yet another idea:

21:04 <DocScrutinizer> do the same with high voltage in evacuated gas containment, to build a gas discharge setup where the pads start glowing in the dark

21:05 <DocScrutinizer> or use kirlian (high voltage high frequency) and see the mini tesla-transformer alike sparks and StElms discharge on the pads in plain air

21:06 <DocScrutinizer> or use galvanic effect in liquid, to form a (removable) coating of a clearly colored metal on all the connected pads

21:07 <DocScrutinizer> copper probably not that good on gold pads - silver might work, esp when you convert it to silver-sulfid which is deep black

21:10 <DocScrutinizer> or cover the whole PCB with some low quality varnish (low adhesion, quite some pores) and then use AC to make that varnish pop off on pads where gas micro bubbles build up and vanish every 1/100 second (at 50Hz AC)

21:12 <DocScrutinizer> sure, it's unclear whether any of those weird ideas will work for those BGA footprints where yo got >2 pads / mm

21:14 <DocScrutinizer> but it's also unclear how wolfspra1l 's equation for expense to do PCB teardown and RE would look like, when we count in the work to actually create a connection plan from those layer photos

21:14 <DocScrutinizer> and then a true semi decent schematics from that connection plan

21:15 <DocScrutinizer> I guess the work for that is like 100 times the work for the sanding down and doing scans/photos

21:15 <DocScrutinizer> err missed a 0, meant thousand times

21:19 <DocScrutinizer> maybe a mix of automated coarse and manual fine analysis/search of pads that are connected may yield good results: use a fine long line carbon brush (kinda similar to those formerly used to clean vinyl records) to spot X and Y coords where to do detail search for a connected pad

21:24 <DocScrutinizer> damn hell FFS, those 0402 footprints are monsters compared to the friggin fine pitch BGA

21:29 <DocScrutinizer> maybe this one helps a bit to get an idea

21:29 <DocScrutinizer> http://maemo.cloud-7.de/Gallery-N900-exploded/platine_01.jpeg

21:30 <DocScrutinizer> it's already not good enough to do a proper RE

21:30 <DocScrutinizer> via dents almost invisible

21:31 <DocScrutinizer> when you zoom in so a 0402 footprint is the size of a fingertip, you can guess them via dents

21:33 <DocScrutinizer> at zoom 250% you actually can see most of them, but you also see the artifacts

23:49 <abushcrafterforg> Anyone tried audio editing on the nano note?

23:53 <DocScrutinizer> maybe that's already a little bit too demanding a task for that tiny machine? regarding the missing audiocard, the missing USB hostmode to plug in a audio card dongle, the limited gfx on screen

23:53 <DocScrutinizer> sox might work just fine

23:53 <DocScrutinizer> ;-)

23:54 <DocScrutinizer> though maybe not in realtime