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<niklas> when compiling a bitstream for an ECP5, is there any way to "tune" the result?
<niklas> I'm very slightly missing timing, which I notice by some glitches on the HUB75 panels
<niklas> but only very slightly
<niklas> like, wenn I remove one 64bit wide, completely unused reg it works just fine
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<tnt> niklas: when you say "very slightly" ... what does the timing report say ?
<niklas> well...
<niklas> Warning: Max frequency for clock '$glbnet$clock': 85.82 MHz (FAIL at 125.00 MHz)
<niklas> Info: Max frequency for clock '$glbnet$display_clock': 78.36 MHz (PASS at 25.00 MHz)
<niklas> Warning: Max frequency for clock '$glbnet$rgmii_rx_clk$TRELLIS_IO_IN': 109.90 MHz (FAIL at 125.00 MHz)
<tnt> nextpnr timing are pretty pessimistic, so I'm a bit surprised that a "slight" timing error would cause anything in practice.
<tnt> Ok, so 85 vs 125 is _not_ "very slightly"
<niklas> very slightly as in "it works sometimes, sometimes not" :P
<tnt> You can try different seed on nextpnr. You can try abc9 on yosys (if not already using that). But that kind of difference you probably need to change your design to fix the critical path.
<niklas> okay thanks
<niklas> I already did solve this issue by making that additional buffer even bigger, at some point it the just works again :D
<niklas> is there any way to flash an ECP5 using glasgow?
<niklas> programming works fine, but now I want to burn the flash
<tnt> I think there is a script somewhere to generate a SVF that does that.
<niklas> yup, currently playing around with that
<niklas> I changed the flash id and it runs through, but it doesn't work
<niklas> there is activity at the SPI flash, but the bitstream doesn't load
<tnt> Did you change the command to 0x02 ?
<tnt> line 121 ?
<niklas> yes
<tnt> The windbond flash on the colorlight board uses 0x02 as "Page Program".
<tnt> Does the old / original design still load ?
<niklas> yes
<tnt> (to see if the "erase" worked)
<tnt> :/
<niklas> no, it doesn turn on the user led after 2s which is a bitstream thing
<niklas> my bitstream doesn't do that
<niklas> I did change the ID through, so I think the comms generally works
<niklas> without fixing the flash ID; the scriot didn't work at all
<tnt> The flash might be locked
<niklas> okay, but there sure is a mass erase to unlock it?
<tnt> yeah, it would just be a software protection, it needs some command to unlock it.
<niklas> okay I may also solder on a new flash?
<tnt> having an applet that can tunnel SPI through that JTAG transport would sure be useful so you could run the normal spi_flash commands etc ...
<tnt> niklas: you could also just connect the glasgow to the spi flash pins ...
<niklas> what file would I flash then?
<tnt> ecppack can generate a binary file instead of the svf
<tnt> Could you try to add :
<tnt> SDR 32 TDI (00000058) TDO (A8FFFFFF) MASK (FF000000);
<tnt> after the "check id" ?
<tnt> (this should fail but the error should print the status register 1)
<niklas> E: g.applet.interface.jtag_svf: SDR command failed: TDO <00000000000000000000000000000000> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<tnt> Err sorry, it's A8 not 58 ...
<tnt> My bitflipping in my head failed me.
<niklas> TDO <00000000011000000110000001100000> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<tnt> So now I just need to remember how this thing works :p
<tnt> MMm, this would be SEC=1 TB=1 BP=000 which is weird
<tnt> Could you run it with A0 and Ac ? to get the other status registers ?
<tnt> Your flash is a windbond one right ?
<niklas> yup
<niklas> this one
<niklas> AC: TDO <00000000000000100000001000000010> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<niklas> A0: TDO <00000000000111000001110000011100> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<tnt> Ok, so indeed the block protection is set AFAICT.
<tnt> SDR 8
<tnt> TDI(60)
<tnt> SDR 16
<tnt> TDI(8000)
<tnt> this should unlock it. Add after the manufacturer id check
<tnt> also add RUNTEST 1.00 SEC; to wait a bit since the command can take some delay.
<tnt> Also I forgot the ; after the TDIs.
<niklas> still loads the old bitstream :/
<tnt> Can you redo the A0 read after those commands ?
<niklas> do I need to change the erase_block_size, btw?
<niklas> since this is for the 128Mbit flash, and I have 32Mbit
<tnt> No it still has 64k sector erase.
<niklas> A0: TDO <00000000000111000001110000011100> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<tnt> Ok, so the status register write had no effect :/
<niklas> this was in a separate session
<niklas> or should I ready immedietly afterwards, by appending the read A0 lines?
<tnt> Ah yeah, they need to be one after the other.
<niklas> TDO <11111111000111100001111000011110> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<niklas> okay then it works
<tnt> how so ?
<niklas> well the status register is changed
<tnt> It's supposed to be 0 :)
<niklas> I still don't fully get how I can remove the protection
<niklas> yeah, but at least it's changeable
<tnt> Ah, it should be TDI(0080) and not 8000
<tnt> I reversed the bits and forgot the bytes ...
<niklas> TDO <11111111000000000000000000000000> & <00000000000000000000000011111111> != <11111111111111111111111100010101>
<tnt> Much better !
<tnt> now remove the A0 read so it doesn't stop and see if it writes.
<niklas> yup
<niklas> takes forever tho
<niklas> ~ 2min
<tnt> yeah the svf just uses super long delays ...
<tnt> did you enable bitstream compression in ecppack ? That can help reduce size and so load time :)
<whitequark> also raise the jtag freq?
<whitequark> if you didn't already
<tnt> Ah yeah definitely. 100k default is slow
<tnt> whitequark: btw, how would you suggest implementing spi-through-jtag so that the spi applets can easily be re-used ?
<whitequark> it's very safe but very slow yeah
<whitequark> well, good question
<whitequark> ideally we need a BSDL reader first
<niklas> nice!
<niklas> it worked!
<niklas> bitstream is now permanently flashed :3
<whitequark> then at first make the BSCAN sequences at host
<tnt> \o/
<whitequark> which will be very slow
<whitequark> and maybe then somehow optimize it so it isn't
<whitequark> I was thinking about this for a while but I hven't been able to spend much time workign lately
<tnt> whitequark: huh ? This isn't using bscan AFAIK, the ecp5 has a spi tunnelling mode.
<whitequark> oh
<whitequark> ok that's much easier then
<whitequark> how does it work?
<tnt> There is a small init sequence to put it in that mode, then after, each 'Shift DR' or N bits will end up on the SPI bus and you get the result on TDO lagging by 16 bits.
<whitequark> 16 bits? not 8?
<tnt> Apparently. I find it weird too ...
<whitequark> ok if you give me some example i can just implement it
<whitequark> i have a versa here
<tnt> But like : SDR 32 TDI (00000050) TDO (A8FFFFFF) MASK (FF000000); this reads SR0
<tnt> this is the script that he used. You can clearly see the various SPI commands to the flash.
<whitequark> ohhh so you shift 32 bits, first 8 is the input, last 8 is the output?
<tnt> yup. at least for that particular command. Other commands would have different length.
<whitequark> i wonder if it needs the intermediate 16 tck cycles to reverse the spi bits before jtag or something
<tnt> Also, if you don't need to read result, you don't have to shift. Like SDR8 TDI (60); is SPI command 0x60 set write enable.
<whitequark> hm
<niklas> tada
<niklas> thats it for now
<niklas> going to sleep, thanks everyone!
<tnt> niklas: :)
<whitequark> tnt: I just need to enter SPI mode, right?
<whitequark> one SIR;SDR
<tnt> Mmm ... at some point you probably want to deconfigure the fpga or you won't have access to the spi pins right ?
<tnt> I'm assuming that's why there is the "clear / erase".
<daveshah> There is actually a bitstream setting for background SPI flash programming, but I would need to patch nextpnr to make it easy to set
<daveshah> Also it comes with the significant compromise that once enabled you can't access SPI flash from the fabric at all, even if JTAG isn't used afaik
<daveshah> The clear/erase works around that by clearing out the bitstream first
<tnt> I guess sending that part could be a cli option if/when background spi flash is implemented and enabled.
<whitequark> ah
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<_whitenotifier-3> [glasgow] whitequark commented on issue #179: python modules not found after install - https://git.io/JvDID
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<Spida> what is the current time estimate for the crowdsupply?
<Spida> I would be willing to populate a board myself, but I cannot do BGA/DFN/QFN...
<whitequark> cc esden
<esden> humm... I have a hard time giving any estimates at the moment. All I can say is that I am back on the campaign front this week. But I can't say for sure how long it will take to fill in the gaps and launch it though.
<esden> Spida: what does it mean that you would be willing to populate the board but you can't do BGA/DFN or QFN... that is a contradictory statement ;)
<esden> Does it mean, "the will is there but the flesh is weak?" ;)
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<whitequark> heh
<whitequark> esden: I was thinking you'd answer that, and I'm wondering if we should make "no ETAs" a well visible policy
<whitequark> in certain aftermarket Android firmware communities asking for a ETA is a bannable offense, I think doing that is a bit too far but I certainly see where they come from
<esden> I will have to commit to ETA as soon as we launch the campaign. But those are generally understood that it is a crowd funding campaign and "things can happen", but that said, I have the rythm of one update a week during campaign and one update a month after the campaign until fulfillment is done.
<esden> and those updates have to reflect the progress
<esden> whitequark: ohh well... asking for ETA beyond that is annoying but understandable
ChanServ changed the topic of #glasgow to: glasgow debug tool · code https://github.com/GlasgowEmbedded/glasgow · forum https://glasgow.whitequark.org · logs https://freenode.irclog.whitequark.org/glasgow · production https://www.crowdsupply.com/1bitsquared/glasgow · no ETAs at the moment
<esden> hehe... ok ;)
<electronic_eel> the question also is if esden wants to produce revC1 nearly as it is or incorporate most of niklas changes into it
<electronic_eel> incorporating the changes incl. new parts would mean at least one round of testing
<whitequark> yup
<electronic_eel> the pricing possible with the new parts is really tempting...
<whitequark> I think that pricing isn't something esden could provide
<whitequark> but the yield improvement by ditching the current shifter package still seems significant, not to mention making assembly easier for everyone
<esden> I will definitely go trough the BOM and create two of them. One with the current set of parts, and another with the easier to assemble parts.
<electronic_eel> sure, he can't beat jlcsmt, but I think there still is significant price improvement possible
<esden> I will be also sourcing proper quotes for the campaign. Then we can decide if it is worth waiting to incorporate the changes and go through another round of validation.
<whitequark> makes sense
<esden> the revC1 can be assembled reliably, if you turn a few of the stencil aperture and solder paste application knobs.
<esden> it is only really a problem for the "casual assembler"
<esden> or if you make a hand full at lcsc who does not put any effort into optimizing the process
<whitequark> hm
<whitequark> or for rework
<esden> right
<esden> still the as I said before, I like the changes ... especially if the new packages for the parts are easier to source and lower cost
<electronic_eel> whitequark: I know you like to minimize risks and such...but when we do another round of validation, what do you think of replacing the ADC with the INA233 in revC2?
<esden> electronic_eel: sbtw, the test jig board is finally being shipped to me this week.
<electronic_eel> I would really like to have the ability to set a current limit
<electronic_eel> electronic_eel: nice, lets hope it goes out with all the corona limits...
<whitequark> electronic_eel: I'm open to that idea
<electronic_eel> I meant esden of course
<whitequark> since we have to revalidate revC2 anyway
<whitequark> and it might also reduce cost further
<electronic_eel> I think the costs are about the same, it has just much more features for us
<whitequark> it removes a few passives, right?
<whitequark> possibly a few passive values
<Spida> esden: basically, yes :-) if anybody has an oven to reflow the bga and DFN, I could do the rest :-)
<electronic_eel> yeah, you don't need the voltage dividers on the input
<whitequark> that could make esden very happy :p
<whitequark> Spida: what about hot air?
<whitequark> not trivial, I know, but with some experimentation on sacrificial boards it's doable
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<Spida> whitequark: I do have hot air, but wasn't able to do QFN reliably in the past.
<electronic_eel> in my experience you can do qfn with a bit of practice, but bga needs a more controlled environment to work well
<whitequark> I only really reworked BGA, never actually assembled it from scratch
<electronic_eel> and you can't re-do bga if it failed without a full reballing
<whitequark> and I didn't find it -that- bad
<whitequark> but I know it might take me more than one try with a Glasgow board if I tried
<whitequark> now, reballing is an incredible pain in the butt
<electronic_eel> I had some printer interfaces that had a manufacturing defect (bad soldering in the first years after rohs)
<esden> We will also have to discuss the LVDS connector situation a bit too. There is a bit of a circular dependency between it being TH/SMD with location pins, Test jig top probes/not top probes or even added test pads on the bottom of the board.
<tnt> My attempt at reballing a 0.5mm pitch ecp5 with just the "normal" stencil (i.e. same one I used for the whole board) didn't quite work out, too thin.
<esden> Several people mentioned that they would love to use the LVDS connector for "things" so I think we should populate it. But if we do we have to test it.
<electronic_eel> I got about 50% to work with a reflow, couldn't get the others to work
<esden> I actually think the connector has to be tested even if we don't populate that connector.
<esden> or rather pads have to be tested that the signals are not shorted or something
<whitequark> doesn't your fab offer 100% etest?
<whitequark> or do you mean assembly issues?
<esden> yes
<whitequark> I think we could use, uhm
<esden> if the bga is connected correctly
<electronic_eel> esden: ah, yeah the lvds testing we talked about
<whitequark> boundary sc... we don't have boundary scan on ice40, damnit
<tnt> esden: buy an xray :p
<whitequark> we could use a test bitstream that does the same thing as bscan
<esden> tnt: I am seriously consideridng it! no joke!
<electronic_eel> we don't need boundary scan, we could use the test bitstream
<electronic_eel> unfortunately the ice40 just has pullups, not pulldowns
<whitequark> can bitblast it
<whitequark> well, test bit by bit
<whitequark> it'll be just a few milliseconds if we look for hard shorts
<esden> that is already better than nothing whitequark
<esden> if we connect the test jig to the pins, I will have to at least use a connector that has locating pins, so that is a small change to the pcb to add those holes
<esden> honestly having that connector well located is useful for the user too
<whitequark> definitely true
<whitequark> but... no space for it I think
<whitequark> it's super tight there
<esden> no space for locating pins? humm, I will have to take a look then.
<electronic_eel> esden: you mean soldering the connector and then try to hit the pads with a jig from above?
<esden> no if we stay with the SMD connector, we would go with cup pogopins onto the pins themselves
<esden> if we don't populate the connector, we go onto the pads
<esden> if we change to a TH (that will be really hard, there is not really enough routing space for that) then we can go from the bottom with cup pogopins.
<electronic_eel> yeah, if we don't populate that isn't that hard.
<electronic_eel> the smt connector is quite expensive, right?
<esden> not really, only if we get a samtec connector it is expensive
<esden> I would source it from a korean or chinese manufacturer instead
<electronic_eel> have you checked for alternatives in this size that aren't samtec?
<esden> they make to order connectors, but you have to buy 5k of them or so
<electronic_eel> hmm 5k glasgows...
<electronic_eel> isn't that a bit too many?
<whitequark> it's quite a few
<esden> I did things like that in the past. I have bags of some connectors still sitting here for an old project. At the end it was still cheaper than buying existing connectors from an established manufacturer.
<electronic_eel> but still a part of your earnings end up in dead stock
<esden> Yeah, but I would have spent even more on COGs if I went with the more expensive connectors. The price difference can be 1/10th of the price if not less.
<esden> so if you buy a 100 of the expensive connector you can buy 1000 of the cheap one. And who knows how many glasgows will sell? The interest is there. :)
<electronic_eel> I have seen that samtec offers these connectors with locating pins on the bottom. that would improve positioning accuracy without the need to go full tht
<esden> yeah exactly and I would try to find an alternate source that is less expensive than samtec for those.
<esden> anyways, first we need to see if I can add the locating pins at all to the board layout...
<esden> and I will do that based on the samtec locating pin diagrams
<electronic_eel> hmm, when I look at the layout adding the locating pins seems completely easy to me
<electronic_eel> at least the samtec ones are at like the second row on each side, between the pads
<electronic_eel> we have just vias to gnd at that position, we could easily move these above
<whitequark> ah I misunderstood
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<esden> I did order ACES connectors in the past... (they make really nice black picoblade compatible connectors)
<electronic_eel> they look nice!
<esden> I will contact them and ask for samples.
<esden> I am happy to stock those connectors in the future for those that want to put their own glasgows together. (I do that already for the jtag connectors so not a big deal)
<electronic_eel> could you also ask them for mating connectors?
<electronic_eel> I checked the samtec ones, they are nice but like 5$ each
<esden> Yeah of course. Just smd?
<esden> or TH too... TH is usually a bit of a pain to route...
<electronic_eel> I'd say yes, just smd with these positioning pins
<electronic_eel> th in 1.27mm is just a pain
<esden> sure
<esden> I guess the female version does not have locating pins at least officially: http://www.acesconn.com/series/60012-xxxxx-xxx/2403
<esden> so I will ask them if they have an of menu version that has locating pins
<esden> (fwiw I don't nee the picoblade compatible connector on their website, so it is definitely an off menu item ;) )
<electronic_eel> about testing the lvds connector: I think it will not be easy to drop pogo pins on top of the pins
<electronic_eel> wouldn't it be an alternative to mount a female connector into the jig and lower it over the connector?
<electronic_eel> like a small pcb, maybe with a bit of logic for testing too
<esden> Yeah but the cycle count and retention force might become an issue. Still it is an option I think.
<tnt> A vertical 1mm thick pcb with "side" spring contacts ?
<electronic_eel> I'm not expert in jig building and haven't done any work on so small test points
<tnt> Is there something on the back that prevents just putting a test pad under each of the SMD pad with a via-in-pad ?
<electronic_eel> via-in-pad is $$$
<tnt> Those pad are huge, the amount of solder that would 'fill' the via is negligible ...
<tnt> so no need to plug them.
<electronic_eel> we have space for testpoints on the backside
<electronic_eel> I think we wouldn't even need some via-in-pad mechanism, we could use regular vias as we have enough space around the connector
<electronic_eel> of course a via, small trace and testpoint add some small stub line which gives an impedance bump
<electronic_eel> but this isn't a 10g serdes, so I don't think it will matter much
<electronic_eel> but the test pads wouldn't show problems of a bad joint from pcb to connector
<electronic_eel> now most of the intended buyers will probably be able to easily fix such an issue, but it is still a small hole in test coverage
<niklas> okay, I'm currently finalizing the JLCSMT order
<niklas> I'm still a bit worried about the IO driver LDO
<niklas> I didn't think about all the things you meantioned, I would rather look for a more suitable parts
<niklas> I was also thinking very hard about just using the TPS73101 for now, but I really can't justify 2x $1 for a damn LDO
<niklas> maybe you can help me to find a proper replacement for <20ct?
<whitequark> more suitable parts?
<niklas> than the richtek
<whitequark> also it's not a "damn LDO", it's an integral part of overcurrent protection on this board.
<niklas> yes, that's why I want to have a closer look at it now
<whitequark> right
<niklas> still it's just a fancy LDO, and I'm sure there are alternatives for cheaper
<niklas> even for an advanced LDO, $1 is quite a lot
<whitequark> yes, that's true
<niklas> thats like 7% of the BOM
<whitequark> you'd think linear makes it and not ti
<whitequark> reminds me of the lattice devboard which has i think a $10 ldo
<whitequark> from linear
<whitequark> for no goddamn reason at all
<electronic_eel> in my experience it is not that easy to find ldos with good overcurrent protection
<electronic_eel> they are available, but usually not the cheapest ones
<whitequark> yeah, that's why i did not look too hard
<whitequark> it was hard enough to find this one
<electronic_eel> and in glasgow we really need good ocp, it is an expected mode of operation, not just some fallback of not catching fire
<whitequark> in theory with INA230 we could use it, but I'm not sure how I feel about only having one level of OCP protection
<niklas> seems similar to TPS73, but is just 20ct
<electronic_eel> the ina233 is not that fast, it uses an adc and digital comparison
<whitequark> yeah, that's why
<daveshah> > For reliable operation,
<daveshah> do not operate the device in a current-limit state for extended periods of time.
<daveshah> From the 79901 datasheet
<daveshah> Don't know what they mean by extended but doesn't sound great
<niklas> yup, and no dedicated reverse voltage protection :/
<electronic_eel> they don't have a graph showing overcurrent regulation and never mention the word "foldback" in the whole datasheet
<electronic_eel> I just browsed digikey for matching ldos and there is none having all features we want except the TPS73101
<tnt> adjustable + reverse current protection + specified Ilimit with foldback ... that's indeed hard to find.
<_whitenotifier-3> [GlasgowEmbedded/glasgow] whitequark pushed 1 commit to master [+1/-0/±2] https://git.io/JvDOB
<_whitenotifier-3> [GlasgowEmbedded/glasgow] whitequark 7cd2205 - applet.sensor.hx711: new applet.
<_whitenotifier-3> [glasgow] Error. The Travis CI build could not complete due to an error - https://travis-ci.org/github/GlasgowEmbedded/glasgow/builds/665294857?utm_source=github_status&utm_medium=notification
<niklas> yup, came to the same conclusion
<niklas> okay then TPS73101 it is
<electronic_eel> esden: nice, so we could make a small pcb with one of these and have it come from above onto the connector
<niklas> can get them fairly cheap on aliexpress :D
<electronic_eel> niklas: you may get NCPxxx or Renesas xyz or whatever though...
<niklas> yeah but they areN#t cheaper
<niklas> was hoping for a diodes or micrel part
<tnt> Torex has some nice parts but ... none of them are adjustable ... wtf.
<electronic_eel> diodes is good, they often are cheap and well specced
<_whitenotifier-3> [GlasgowEmbedded/archive] whitequark pushed 1 commit to master [+1/-0/±0] https://git.io/JvDO0
<_whitenotifier-3> [GlasgowEmbedded/archive] whitequark 0b51243 - Add G00048.
<_whitenotifier-3> [GlasgowEmbedded/glasgow] whitequark pushed 1 commit to master [+1/-0/±2] https://git.io/JvDOE
<_whitenotifier-3> [GlasgowEmbedded/glasgow] whitequark 2ff8768 - applet.sensor.hx711: new applet.
<niklas> what is the differenece between CY7C68013A-56LFXC and CY7C68013A-56LTXC?
<electronic_eel> datasheet says qfn saw type vs. qfn punch type
<whitequark> what does that actually mean? never seen it before
<electronic_eel> LTX is saw, LFX is punch
<whitequark> I assume the way they separate the packages?
<electronic_eel> yes, how they remove the overmold
<electronic_eel> I think it affects how the side connections are made
<electronic_eel> some qfns just have a bump on the side walls, others have actual pads going around the edge
<electronic_eel> the latter are nicer to work with
<electronic_eel> ok, the punch qfns seem to have a bit different case: https://www.cypress.com/file/41466/download
<electronic_eel> so what we currently have seems to be sawn
<electronic_eel> but I don't see a problem with using punch instead, both should work and have the pads around the edges
<electronic_eel> niklas: what do you think about implementing https://github.com/GlasgowEmbedded/glasgow/issues/165 on your Edinburgh now?
<electronic_eel> I stumbled upon the INA233 too late into the development of revC1 so we didn't include it there
<electronic_eel> but I think it is the clearly superior solution to the adc we now have
<electronic_eel> I offer to do the firmware for it
<whitequark> I can do the firmware
<whitequark> just need a board with it
<whitequark> there'll be UI work necessary too, though at first we could go for strictly identical feature set
<niklas> sure, I haven't ordered yet
<niklas> I don't like firmware but I can send you free assembled prototypes
<niklas> do you have a schematic already?
<niklas> what current would you measure?
<daveshah> Kynix also has a fairly decent price and probably a slightly higher chance of legit than aliexpress
<whitequark> niklas: I think the test board actually has an ina233 already
<electronic_eel> niklas: I don't have finished schematics yet, but I described what I want to do in the issue tracker
<electronic_eel> whitequark: no, it is another variant on the test jig board
<whitequark> ohh
<electronic_eel> ina260
<electronic_eel> i found the ina233 like two or three weeks after we selected the ina260 for the test jig board
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<whitequark> i see
<electronic_eel> niklas: do you have published your schematics changes with the new parts and so on somewhere?
<electronic_eel> the current that the ina233 should measure is the current over the 0.68 ohms resistor after the TPS73101
<electronic_eel> the voltage to measure is directly the vsense input, without voltage divider (since it can measure up to 37v, but the tvs diode will prevent going so high)
<electronic_eel> we could also use a different tvs diode, but I'm not sure that its worth it
<niklas> so no more Vsense?
<electronic_eel> vsense yes, but no more vsamp
<awygle> the voltage divider is at least in part to a) filter the input to the ADC and b) increase the impedage on the vsense line so it's not too much of a draw on the DUT
<awygle> ... "impedage"? impedance.
<electronic_eel> the ina233 has a high impedance input that can go up to 37v, so no voltage divider necessary
<awygle> mk
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