02:40 <ZetaR> DocScrutinizer05: I measure about 0.4mm gap between board and BGA on a couple old phone PCBs that I have, by wedging stacked pieces of paper in the gap followed by a measurement of the stack using Vernier calipers.

02:55 <DocScrutinizer05> yeah, for BGA that's prolly within normal parameters

02:56 <ZetaR> IIRC, the modem has larger pads than normal, right?

02:58 <ZetaR> Yes, in one of the photos I have they look quite large. That may affect how high the chip is.

03:12 <ZetaR> Here is a product using PLS8-E which lists dimensions: http://www.gtteurope.co.uk/images/uploadpics/LM-PLS8-E-SM_datasheet_v2.pdf

03:12 <ZetaR> Technical drawings rather.

03:15 <DocScrutinizer05> PHS8 HID lists stencil thickness of 110µm

03:18 <DocScrutinizer05> or 150µm. both are suppoesed to get less thick during soldering when solder paste liquifies and solvent/flux separates from lead http://wstaw.org/m/2015/07/21/plasma-desktopHy1947.png

03:18 <DocScrutinizer05> also the solder spreads and thus gets thinner

03:18 <ZetaR> Larger pads probably reduce the final height, by increasing the influence of solder-pad adhesion versus solder surface tension.

03:18 <DocScrutinizer05> yep

03:46 <DocScrutinizer05> https://blog.replicant.us/2015/07/rmll-feedback-optimus-black-advancement-and-cccamp/

13:59 <DocScrutinizer05> random stuff http://wstaw.org/m/2015/07/21/plasma-desktopMI1947.png