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<houkime> needed connector displacement: around 2.9 mm (optimistic).
<houkime> on-bob connector movability max 1.3 mm OTG-defined (which probably will still ruin sth else)
<houkime> bob X-axis mobility as a whole - doesn't seem to be very constrained provided that you manage to place flash etc in the right place.
<houkime> preliminary conlusion - bob form adjustment might be needed to enable movement of Hackerbus etc X+ direction without displacing flash etc.
<houkime> gonna sleep. bye
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* enyc meows
<enyc> him-cesjf: ooh godo luck!
<enyc> error
<enyc> houkime I mean, aaah, not here
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<houkime> Joerg-Neo900: besides camera, flash etc is there a slot in the case that Bob needs to fit in?
<houkime> if we could just move HB with 2 OTG holes 3 mm and extend bob towards pcbcenter to accomodate this move that would be enough.
<houkime> probably some trades here and there can diminish movement to 2mm-esque.
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<houkime> it looks like the only concern is the battery
<houkime> also the design of usb OTG holes itself is concerning. You sure it is ok to run a differential pair like that? 7.5 mm apart?
<houkime> usually you keep these signals together for them to generate less noise
<houkime> this is how physics works. + edges limits - edges' influence on surroundings. Like a dipole thing.
<houkime> You can't make them less sharp because it is a fast speed bus, so you keep sharp edges, but pair them together instead.
<enyc> houkime: i've certainly seen the USB2.0 wires along side each other a mm or 2 on pcbs
<enyc> (data wires)
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<houkime> Rechecking guidelines and stuff. Nope, I'm certainly right, at least it is a consensus position. There're also quite stict routing rules. It is rather 0.2 mm depending on material etc. Metacollin used 0.5 (still don't know what material he targeted).
<houkime> you Do want to separate OTG-D pair from other signals though.
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<houkime> It includes Vbus and OTG ID which are also part of the usb
<houkime> so you separate two traces of the differential pair from these 2, and yes, even on metacollin's layout this separation is about 1.5 mm.
<houkime> there's a little quirk here though. The thing is, you need to maintain impedance between traces and air-crossing pins is an electrically different from pcb situation
<houkime> this further complicates things because electrical properties of air are not constant and depend on humidity and stuff.
<houkime> Directing differential pair across pogopins looks like quite a bad idea, although I need to calculate stuff to be certain about it.
<houkime> (and like with lightbeams which partially bounce off any material with n different from air/vacuum, signal gets partially echoed back on any transition between electrically different phases)
<wpwrak_> to be honest, i never really expected that OTG USB hack to work, so i just tried to make it as electrically inoffensive as possible if not used ;-)
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<houkime> have you considered to build a small testboard to test a pogopin approach?
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<houkime> It would be rather reasonable to test this thing before inclusion to v2?
<houkime> (oh well, it is not included in v2 anyway. V3?)
<houkime> Unless it is tested I shall consider pogo geometry undecided and disregard cutouts.
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<houkime> This gives more mobility to connectors, which I will use to try solving usb collision problem.
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<houkime> HB connector datasheet URL (Harwin) is outdated
<houkime> correct docs are on this page https://www.harwin.com/products/M50-3150442/
<houkime> *outdated means 404
<houkime> however aaaah, Harwin says that this connector goes obsolete 15-th June 2018
<houkime> Connector CON1703
<houkime> this is in its datasheet
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<houkime> It might be actually possible to cram things together on bob if using tented vias under connectors.
<houkime> and do some HEAVY pin rearrangement
<houkime> It might as well produce neeeded 3 mm, although maybe not quite