<furan->
so turns out what I'm looking at is actually MIPI (IEEE P1149.7 cJTAG)
<furan->
guessing if I want glasgow to talk to that I'll need to code it up
<whitequark>
cJTAG isn't implemented yet yeah
<whitequark>
i don't have any cJTAG devices
<furan->
gotcha
<Stormwind_mobile>
whitequark: saw that photograph already. Still, how does a MCM justify this strange ball pattern? They can route the signals at leisure on the interconnect layer and maybe gotten away with a smaller package. Unless the bonding process needs the physical space.
<whitequark>
Stormwind_mobile: it's single layer
<whitequark>
it looks like
<whitequark>
oh, and yeah, the bonding process does need physical space
<Stormwind_mobile>
Stuff I basically know nothing about ^^°
<Stormwind_mobile>
Beside more or less educated guesses
<Stormwind_mobile>
Also no clue how free manufacturers are with package sizes, like is there even e.g. a 15*15 BGA?
<whitequark>
i think there's practically every imaginable bga somewhere out there
<mwk>
15*15 as in 15 by 15 balls?
<XgF>
The routing layer of a BGA is pasically a smol PCB, so I suspect they've got a lot of freedom for not very much expense there
<daveshah>
Lattice even have a patent for their pattern